Mühlbauer High Tech International, an experienced provider of smart card and ID turn key solutions enters into an alliance with long-term business partner Oerlikon Esec, a leading provider of semiconductor assembly equipment. The partnership enables the companies to expand their presence by providing complete manufacturing solutions and services in the rapidly growing IC module business in the smart card industry and related emerging markets.

Today, over four billion smart card units are manufactured annually. Driven by the banking sector (e.g. payment cards), governments (e-passports, e-ID cards) and telecommunications (e.g. SIM cards for mobile phone), the smart card industry is projected to grow annually at double digits. To keep up with this demand, smart card module manufactures require the latest assembly technology and a partner who can offer the highest levels of output, optimal production yields, and efficient support.

Mühlbauer and Oerlikon Esec’s long time cooperation has now transitioned to a formal alliance, focusing on turn key solutions for the IC module assembly market. Customers will be able to take advantage of the output and reliability of Oerlikon Esec’s die bonder and wire bonder technology with Mühlbauers worldwide standardised encapsulation and testing technology, embedded in Mühlbauers system integration expertise and proven turn key solutions. Additionally, customers will have access to an enhanced service network and one point of contact for all support needs. Together, customers will benefit from leading edge technology, faster response times, and one stop shopping, resulting in the lowest cost of ownership.

 Thomas Betz, member of the management board at Mühlbauer AG, defines the cooperation accordingly: “Our customers are in the focus of our thoughts and actions. The goal is, to provide leading edge turn key solutions for our clients in all related areas of Smart ID. The cooperation with Oerlikon ESEC is the golden opportunity for our customers to get the most modern and innovative technology for all process steps in the IC module manufacturing for smart cards. The service and sales network around the globe, provided by Mühlbauer AG and Oerlikon ESEC is also unbeatable and an additional benefit for our clients.”  

Kurt Trippacher, CEO Oerlikon Esec, comments: “As the smart card market continues to expand into new fields, the requirements will become more complex. In order to best respond to the increasing complexity and market demands, in-depth knowledge of the manufacturing process and technology are crucial. Oerlikon Esec and Mühlbauer have a proven track record in the smart card industry. To maintain market dominance, closer collaboration will permit us to keep up with the growing needs of our customers and enable both companies to expand our market share in this continually growing market segment.”

Mühlbauer AG is the only one stop shop for complete manufacturing chain of smart cards or ID products world wide. In the IC module manufacturing turn key solutions are installed around the globe. With an installed equipment base of more than 300 systems in the area of encapsulation and test handling, Mühlbauer AG has the biggest market share world wide. To cover the newest requirements for contact less and pre personalized products, the newest model CMT 6560 was launched to the market beginning of 2008.

Swiss-based Oerlikon Esec has been at the leading-edge of assembly and packaging equipment for 40 years setting innovation trends in the industry. The new Wire Bonder 3200, launched in September 2007, and the newly developed die attach platform Die Bonder 2100 xP constitute the most modern equipment fleet available in the market.